News
December 2008
- Dr. Kumar recognized as an IEEE Fellow at the 2008 International Electron Devices Meeting in San Francisco.
November 2008
- Seminars presented at NTU and NCTU in Taiwan, and NUS in Singapore.
- Dr. Kumar chairs a session at the IMEC Workshop on 3D TSS (thru silicon stacking) technologies in Hsinchu, Taiwan,
October 2008
- Dr. Kumar assists in the teaching of EMTM 640 at the University of Pennsylvania, a program co-sponsored by the Wharton School of Management.
- Seminar presented at University of Rochester
- Dr. Kumar appointed a Distinguished Lecturer for the IEEE Electron Devices Society.
September 2008
- Seminar presented at UC Berkeley
- Mark Vinson joins TCX team providing services for the development of cost models for the 3D stacking of IC chips
July 2008
- Dr. Kumar plays a key role that leads to IMEC’s announcement that Qualcomm has joined their 3D program. http://www2.imec.be/imec_com/qualcomm-and-imec-collaborate-on-3d-integration-research.php
April 2008
- McGraw Hill publishes “Fabless Semiconductor Implementation”
- ITRS Spring Workshop Keynote presentation: “Present and Future Technology Challenges for Fabless IC Implementation”, by Dr. Kumar and co-authors at Qualcomm.
February 2008
- Dr. Kumar recognized as an IEEE Fellow by the Solid-State Circuits Society at the premier International Solid State Circuits Conference (ISSCC) in San Francisco.
November 2007
- IEEE Board of Directors vote to elect Dr. Rakesh Kumar a Fellow of the IEEE for his “Entrepreneurial Leadership in the field of Integrated Circuits”.
- TCX services engaged by Solar Junction, Inc. an emerging company focused on the development of leading edge, high efficiency solar cells.
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